Source: FUNDAMENTALS OF MICROSYSTEMS PACKAGING C H A P T E 1. R INTRODUCTION TO MICROSYSTEMS PACKAGING Prof. Rao R. Tummala. “LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems. FUNDAMENTALS OF. MICROSYSTEMS PACKAGING. Rao R. Tummala. Georgia Institute of Technology. Editor. Angie Hughes. Nancy Trent. Mahesh.
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Fundamentals of Microsystems Packaging: Rao R. Tummala: : Books
This malformed URI has been treated as a string – ‘http: In summary, despite my forty years in microelectronics research, engineering, management, and consulting, I learned new things every time I opened this book. Introduction to microsystems packaging — Role of packaging in microelectroncis — Role of packaging in microsystems — Fundamentals of electrical package design fundamentalx Fundamentals of design for reliability — Fundamentals of thermal management — Fundamentals of single chip packaging — Fundamentals of multichip packaging — Fundamentals of IC assembly — Fundamentals packaginy wafer-level packaging — Fundamentals of passives: Search WorldCat Find items in libraries near you.
Microsystems packaging specialists, who typically focus on one sub-specialty, will find this detailed exposition of the entire field broadening. Would you like to tell us about a lower price?
Fundamentals of microsystems packaging
Advanced Search Find a Library. Finding libraries that hold this item Document, Internet resource Document Type: The only book to teach microsystems packaging written by the field’s leading author.
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Fundamentals of Microsystems Packaging
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Please enter your name. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. For the autodidact, the scholar, or the flagellant, there are even homework problems to test your knowledge. You could probably save some money and find whatever specific information you need on the Internet; however, if you want a very detailed reference book close by this book may be for you.
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This comprehensive textbook offers to all of the above groups a firm grounding in the diverse disciplines comprising microsystems packaging.